GSA2000 Farnell Instruments HEAT SINK, TO-3, 3.3C/W; IC / TRANSISTOR PACKAGE / CASE:TO-3; THERMAL RESISTANCE:3.3C/W; EXTERNAL WIDTH:65MM; HEIGHT:20MM; HEATSINK MATERIAL:ALUMINIU
Part Nnumber
GSA2000
Description
HEAT SINK, TO-3, 3.3C/W; IC / TRANSISTOR PACKAGE / CASE:TO-3; THERMAL RESISTANCE:3.3C/W; EXTERNAL WIDTH:65MM; HEIGHT:20MM; HEATSINK MATERIAL:ALUMINIU
Producer
Farnell Instruments
Basic price
9,05 EUR
Following Parts
NC3FXD | Farnell Instruments | 23,05 EUR |
RL0805FR7W0R33L | Farnell Instruments | 8,05 EUR |
SQE32635C | Farnell Instruments | 5,05 EUR |
ERJL14KF33MU | Farnell Instruments | 5,04 EUR |
EVKCONNECT001 | Farnell Instruments | 14,04 EUR |
KRES02 | Farnell Instruments | 18,04 EUR |
1022M3MF106 | Farnell Instruments | 14,02 EUR |
Random Products
296659005 | Asco | 66,23 EUR |
9070T75D59 | Schneider Automation Inc | 382,85 EUR |
50KJCHLT8840 | Schrader Bellows | 580,15 EUR |
© 2015 Industry Server