B45197A4686K509 Farnell Instruments HEAT SINK, 19X19X25MM; IC / TRANSISTOR PACKAGE / CASE:BGA; THERMAL RESISTANCE:3.9K/W; EXTERNAL WIDTH:19MM; HEIGHT:25MM; HEATSINK MATERIAL:ALUMINIUM; E

Part Nnumber
B45197A4686K509
Description
HEAT SINK, 19X19X25MM; IC / TRANSISTOR PACKAGE / CASE:BGA; THERMAL RESISTANCE:3.9K/W; EXTERNAL WIDTH:19MM; HEIGHT:25MM; HEATSINK MATERIAL:ALUMINIUM; E
Producer
Farnell Instruments
Basic price
21,08 EUR

The product with part number B45197A4686K509 (HEAT SINK, 19X19X25MM; IC / TRANSISTOR PACKAGE / CASE:BGA; THERMAL RESISTANCE:3.9K/W; EXTERNAL WIDTH:19MM; HEIGHT:25MM; HEATSINK MATERIAL:ALUMINIUM; E) is from company Farnell Instruments and distributed with basic unit price 21,08 EUR. Minimal order quantity is 1 pc.



Following Parts
CC0805KKX7R6BB68Farnell Instruments24,08 EUR
CC1812KKX7RBBB10Farnell Instruments20,08 EUR
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MRS251R371Farnell Instruments16,08 EUR
NP100V106M8X115Farnell Instruments18,08 EUR
O32K768S002Farnell Instruments16,08 EUR
PCF0805PR240RBT1Farnell Instruments15,08 EUR

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(keyword B45197A4686K509 Farnell Instruments HEAT SINK, 19X19X25MM; IC / TRANSISTOR PACKAGE / CASE:BGA; THERMAL RESISTANCE:3.9K/W; EXTERNAL WIDTH:19MM; HEIGHT:25MM; HEATSINK MATERIAL:ALUMINIUM; E)
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